Facile dynamic current deposition of high tensile gradient Cu foil with (110) preferred orientation

The conductive copper (Cu) foil is an important raw material in the electronic industry. However, traditional Cu with low tensile strength (∼350 MPa) and poor toughness prone to breakage during production usage, which not conducive its application high-density printed circuit boards high-energy-density batteries. In this work, we report a facile dynamic current deposition (DCD) method for preparing gradient adjustable thickness (9–50 µm) highly preferred crystal orientation of (110). transitions gradually from micron-scale coarse grains nano-scale fine grains, promotes (∼840 while maintaining (∼3.6%). Particularly, shows high conductivity 3.3 × 107 S m−1, indicating promising negative electrode collectors lithium-ion batteries boards. DCD can also provide guidance fabrication other metallic materials.